Embedded isolation filter

ABSTRACT

The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.

RELATED APPLICATIONS

This is a nonprovisional application of a provisional application Ser.No. 61/404,521 by James V. Russell and Thomas P. Warwick filed Oct. 5,2010.

BACKGROUND

1. Field

The present disclosure relates to a method and an apparatus for anembedded isolation filter. In particular the present discourse providesfor a method and an apparatus for an embedded isolation filter embodiedin a printed circuit board (PCB). As noted, applicant's previously filedpatent application Ser. No. 12/655,834 when attaching an electricalcomponent to the bottom side and/or the top side of a printed circuitboard (PCB), there is the problem of power loss due to the distance ofthe capacitance to the points on a corresponding IC for which it isintended. It is not possible to physically locate the capacitancedirectly to the contact pads on the printed circuit, which correspondsto the input output points of an integrated circuit or, in the case of atest board, the corresponding points of the test socket. Similarly,there is the problem of inadequate power dissipation due to the distanceof a resistance to the electrical component. Again, it is not verylikely to physically locate the resistance at the contact pads on theprinted circuit board. Applicant's previous patent application Ser. No.12,655,834 addresses this problem by providing a solution for attachingand embedding a capacitance or a resistance directly to an adaptor boardor an interposer board that is then connected to the main circuit board.The adaptor board could then be connected to the main circuit board bysoldering, electrically connecting it by a conductive elastomerconnection, spring pins or by any other way that is known in the art.There is a need however to provide for an embedded isolation filternotably that can be used in analog and RF applications. An embeddedisolation filter can also have broader uses such as reducing noisecoupling on RF supplies without adding board spaces.

2. The Related Art

RF input designs commonly set RF gain by drawing a small DC current fromthe DC power supply to the RF transistor circuit. This allows the RFsupply to be have a relatively higher impedance than, for example, itsdigital counterpart. It also aids printed circuit board layout, as it isvery difficult to maintain an extremely low impedance so close to the RFdevice.

However, the DC current biasing the RF input design is very susceptibleto interfering noise. This is depicted in FIG. 1. In FIG. 1, the RFdevice interfaces to the 5 Vias on the left. Via #3 and #4 are the DCsupplies for the RF circuit. If Via #2, for example, is noisy due tomuch higher currents, it has the opportunity to couple into the RFsupply pin. Such noisy higher currents are commonly generated in RFdevices from, for example, phased locked loops. Components to remove thenoise must be located some distance away, as shown on external Vias#1-#3. The components—often two inductors and one capacitor—form a noisereduction filter for DC bias currents known as an isolation filter.

As the connection pin pitch of such RF devices gets smaller, thisproblem worsens, simply due to greater proximity to the noisy nodes.This higher density also forces boards to be thicker, which results inmuch longer Vias. Such longer Vias have more coupling potential.

When such noise couples on an RF supply, it creates an unwantedmodulation between the desired input signal and whatever noise couplesinto the device. This unwanted modulation can have several negativeeffects, such as inter-modulation distortion (e.g. measurements IP2,IP3), baseband signal to noise distortion, baseband integrated noise,and noise figure. The end result is that the RF receiver does notperform as well.

SUMMARY

The present disclosure provides for attaching and embedding an isolationfilter directly to an adaptor board or an interposer board containing anRDF device that is then connected to the main circuit board. The adaptorboard can be connected to the main circuit board by soldering,electrically connecting it by a conductive elastomer connection, springpins or by any other way that is known in the art.

In addition, the present disclosure provides for an embedded isolationfilter to mitigate the unwanted, uncoupled noise. This isolation filteris placed as physically close as possible to the actual RF device usingembedded technology as disclosed in applicant's co-pending U.S. patentapplication Ser. No. 12/655,834 which is directly and substantiallyincorporated in its entirety by reference herein. As a result, there isa dramatic reduction in the opportunity for unwanted coupling from thelong noisy Vias or due to a long run on a plane. The common isolationfilter is constructed with two buried inductors sitting vertically inthe PCB and one capacitor sitting horizontally across the RF supply pinand RF ground return pin. The isolation filter forms a simple LC “pi”(π) filter.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates the fall back problems associated with the prior artproposals;

FIG. 2. illustrates the isolation filter of the present disclosure;

FIG. 3 is a Bode Plot illustrating the improvement of the embeddedisolation filter of the present disclosure; and

FIG. 4 is a Bode plot showing the Isolation Filter noise improvementwith Non-Ideal Components.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

Referring to the drawings, FIG. 2 shows an isolation filters inaccordance with the present disclosure for mitigating unwanted, couplednoise by placing this isolation filter as physically close as possibleto the actual RF device on the PCB. This dramatically reduces theopportunity for unwanted coupling due to the long noisy Via or a longrun on a plane. The common isolation filter as shown in FIG. 2 ispreferably built with two buried inductors 6 sitting vertically in theprinted circuit board and one capacitor 7 sitting horizontally acrossthe RF supply pin 8 and the RF ground return pin 9. The filter forms asimple LC “pi” (π) filter—the most common form of isolation filter.

FIG. 3 shows a Bode Plot demonstrating the improvement of the embeddedisolation filter of the present disclosure. Each data trace shows arelative (normalized) coupling to an adjacent noise source. As is thecase with noise coupling, the data trace (existing methods) marked by“+” increases with frequency 21. The data trace showing the improvementof the isolation filter also increases with frequency until ˜100 MHz. Atthat point, however, the noise starts to decrease 22. At 1 GHz, theisolation filter is ˜40 db below the existing method. That is, it is 40db (or 100 times) “quieter” than the standard method. As frequencyincrease, so does the noise improvement (as long as parasitic don'taffect the filter).

The point of decrease represents the resonant point of the isolationfilter and can be adjusted by changing component values. In this examplecase, the component values of 10 nh, 10 h, and 100 pf resulted in aresonant point of 112.6 MHz. Any given value combination can beembedded. Larger values result in physically larger components, and thiscan be limited by the pitch of the device. Larger components are notalways beneficial for higher frequency applications due to non-idealparasitic properties. In practical terms the isolation filter resonantpoint may be as low as 1 MHz and as high as 3 GHz. For cell band andwireless applications, the filter chosen is very practical and maintains˜30 db noise reduction throughout the cell and wireless band region (seeFIG. 4).

While certain embodiments have been shown and described, it isdistinctly understood that the invention is not limited thereto but maybe otherwise embodied within the scope of the appended claims.

The invention claimed is:
 1. A method for reducing unwanted RF noise ina printed circuit board (PCB) containing an RF device, the stepscomprising: Embedding an isolation filter in a PCB containing an RDFdevice by placing the isolation filter as close as possible to the RFdevice in order to dramatically reduce unwanted RF noise due tounavoidable coupling between Vias and planes in the PCB structure byembedding said isolation filter inside of at least one PCB between viasof said at PCB, said isolation filter having terminals in an electricalcontact with a pad of said at least PCB, said pad having a definedconductive elastomer thereon so that electricity conducts through saidisolation filter to place said isolation filter close to said RF deviceto dramatically reduce unwanted RF noise due to unavoidable couplingbetween vias and planes in the PCB structure.
 2. The method according toclaim 1 further comprising building said isolation filter as at least athree component filter.
 3. The method according to claim 2 wherein saidat least a three component filter is formed of two buried inductorslocated vertically in said PCB and one capacitor located horizontallyacross an RF supply pin and an RF ground return pin to form a simple LC“pi” (π) filter.
 4. An improved printed circuit board (PCB) containingan RF device with reduced unwanted RF noise comprising: an isolationfilter embedded in a PCB containing an RDF device wherein the isolationfilter is placed as close as possible to the RF device in order todramatically reduce unwanted RF noise due to unavoidable couplingbetween vias and planes in the PCB structure, said isolation filterbeing embedded inside of at least PCB between vias of said at least onePCB, said isolation filter having terminals in an electrical contactwith a pad of said at least one adaptor board, said pad having a definedisotropic conductive elastomer thereon so that electricity conductsthrough said isolation filter to place said isolation filter close tosaid RF device to dramatically reduce unwanted RF noise due tounavoidable coupling between vias and planes in the PCB structure. 5.The improved PCB according to claim 4 further comprising said isolationfilter is formed as at least a three component filter.
 6. The ImprovedPCB according to claim 5 wherein said at least a three component filteris formed of two buried inductors located vertically in said PCB and onecapacitor located horizontally across an RF supply pin and an RF groundreturn pin to form a simple LC “pi” (π) filter.
 7. The method accordingto claim 1 wherein said pad defined conductive elastomer is an isotropicelastomer.
 8. The method according to claim 1 wherein said pad definedconductive elastomer is an anisotropic elastomer.
 9. The improved PCBaccording to claim 4 wherein said pad defined conductive elastomer is anisotropic elastomer.
 10. The improved PCB according to claim 4 whereinsaid pad defined conductive elastomer is an anisotropic elastomer.